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Mainstream Chip Manufacturers in The Bluetooth Headset Market

Published by

Ancreu Technology Co., Ltd.

2024-05-14

Mainstream Chip Manufacturers in The Bluetooth Headset Market

1. CSR-UK (under Qualcomm)

1) Market share: about 15%

2) Common chip models:

Bluetooth 4.1 single mode: CSR8615, CSR8635, CSR8645

Bluetooth 5.0 dual mode: CSR8670, CSR8675;

3) The latest product models in 2019:

Bluetooth 5.0 dual mode: QCC510X series: QCC5120, QCC5121;

Bluetooth 5.1 dual mode: QCC30XX series: QCC3001, QCC3002, QCC3020, QCC3026;

4) Product features:

Applied to the pure bluetooth headset market, it requires external flash or EEPROM, supports the unique APTX lossless format, stable bluetooth transmission performance, low power consumption, good sound quality, long distance, and good customer reputation

5) Market positioning and customer groups:

High-end Bluetooth headset market, big brand headset manufacturers, e-commerce;

2. Airoha Co., Ltd. - Taiwan (under MediaTek)

1) Market share: about 3%

2) Common chip models:

AB1526, AB1522S, AB1523S, AB1511, AB1512, AB1522S, AB1523S, AB1526, AB1510G, AB1511G, AB1512G, AB1513G;

3) The latest product models in 2019:

Bluetooth 5.0 dual mode: AB1532, AB1536

4) Product features:

Applied to the pure bluetooth headset market, low power consumption, good sound quality, support for 1 to 2 functions, TWS function, built-in FLASH; simple development, no SDK open to the outside world, only PC-side host computer tools.

5) Market positioning and customer groups:

Mid-to-high-end Bluetooth headset market, mid-to-high-end brand customers, e-commerce;

3. Realtek Semiconductor - Taiwan

1) Market share: about 10%

2) Common chip models:

Bluetooth 5.1 dual mode: RTL8763B, RTL8763BA, etc.

3) The latest product models in 2019:

Bluetooth 5.1 Dual Mode: RTL8773B

4) Product features:

It is applied to the pure TWS headset market, with built-in flash, stable performance, low power consumption, good sound quality, and long distance; supports 1 to 2 functions, simple development, no SDK is open to the outside world, only PC-side host computer tools.

5) Market positioning and customer groups:

Mid-to-high-end Bluetooth headset market, mid-to-high-end brand customers, e-commerce;

4. Jerry Technology Co., Ltd. - Zhuhai, Guangdong

1) Market share: about 40%

2) Common chip models:

Bluetooth 5.1 dual mode: AC6936D, AC6932A, AC6939B, AI8001, AI8006, etc.,

3) The main chips in 2019:

Bluetooth 5.1 Dual Mode: AC693N Series: AC6936D, AC6932A, AC6939B, etc.

Bluetooth 5.1 dual mode: AI800X series: AI8001, AI8006B, AI8006C, etc.

4) Product features:

SOC all-in-one Bluetooth chip, which integrates MCU, flash, DSP, PMU and other modules, supports 1 to 2 function, TWS function, ultra-low power consumption 6mA, long distance, stable performance, minimum package QFN 3*2.5, no delay Master-slave switching, bilateral calls, lossless music format, OTA upgrade, few peripherals, intelligent charging compartment;

5) Market positioning and customer groups:

Mid-to-high-end Bluetooth headset market, mid-to-high-end brand customers, e-commerce, TWS, central control headset, unilateral headset;

5. Hengxuan Technology Co., Ltd. (Wind Tunnel) - Shanghai

1) Market share: about 8%

2) Common chip models:

4.2 Bluetooth dual-mode BES series: BES2000L, BES2000T, BES2000S, BES2300, etc.

5.0 Bluetooth Dual Mode BES Series: BES3000

4.2 Dual-mode Bluetooth WT series: WT200M, WT200S, WT200T, etc.

3) The latest product models in 2019:

4) Product features:

SOC all-in-one Bluetooth chip, Hengxuan (BES): low power consumption, good sound quality, mainly for high-end noise-cancelling headphones;

Wind Tunnel (WT): The power consumption is too large, and the main TWS low-end headphones are recommended;

Minimum package QFN40 6*6;

5) Market positioning and customer groups:

Hengxuan: mid-to-high-end Bluetooth headset market;

Wind tunnel: low-end Bluetooth headset market.

6. PixArt - Taiwan

1) Market share: about 3%

2) Common product models:

5.1 Dual-mode Bluetooth: PAU1606, PAU1623, etc.

3) The latest product models in 2019:

PAU1606, PAU1623

4) Product features:

SOC all-in-one Bluetooth chip, PAU16XX series integrated MCU, FLASH and other modules, low power consumption, support no delay master-slave switching, bilateral calls, good sound quality

5) Market positioning and customer groups:

Mid-to-high-end Bluetooth headset market;

7. Broadcom Integrated Circuit Co., Ltd. - Shanghai

1) Market share: about 4%

2) Common product models:

4.2 Single-mode Bluetooth: BK3254 (QFN32), BK3260 (QFN32)

.2 Single-mode Bluetooth: BK3266 (SOP16), BK3266 (QFN32), BK3266 (QFN40)

3) The latest product models in 2019:

4) Product features:

SOC all-in-one Bluetooth chip, integrated with MCU, FLASH, PMU and other modules, slightly larger noise floor, long distance, stable performance, and the smallest package QFN4*4;

5) Market positioning and customer groups:

Low-end Bluetooth headset market, gift market, central control headset

8. Actions Technology (Actions) - Zhuhai, Guangdong

1) Market share: about 3%

2) Common product models:

ATS3001, ATS3003, ATS3005, ATS3007, etc.

3) The latest product models in 2019:

Bluetooth 5.0 single mode: ATS3005, ATS3007, etc.

4) Product features:

SOC all-in-one Bluetooth chip, high power consumption and good sound quality;

5) Market positioning and customer groups:

Mid-end Bluetooth headset market;